MEMS microphone module and method thereof

Details MEMS microphone module and method thereof MEMS microphone module and method thereof

2007-11-21

2010-10-05

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C438S053000, C438S050000, C257S254000, C257S686000, C257SE25006, C257SE25013

Reexamination Certificate

active

07808060

ABSTRACT:
A MEMS microphone module having an application specific IC and a microphone chip is disclosed. The application specific IC has a plurality of first vias and a plurality of first pads, and the first vias are connected to the first pads. The microphone chip has a resonant cavity, a plurality of second vias and a plurality of second pads, and the second vias are connected to the second pads. The microphone chip is disposed on a first surface of the application specific IC with an opening of the resonant cavity facing toward a first surface of the application specific IC. The second conductive vias of the microphone chip are also electrically connected to the first vias of the application specific IC. By placing the microphone chip on the first surface of the application specific IC, the present invention could reduce the package size and increase the reliability of the package.

REFERENCES:
patent: 6178249 (2001-01-01), Hietanen et al.
patent: 2004/0253760 (2004-12-01), Zhang et al.
patent: 2005/0179100 (2005-08-01), Barzen et al.
patent: 2005/0189635 (2005-09-01), Humpston et al.
patent: 2005/0207605 (2005-09-01), Dehe et al.
patent: 2007/0105304 (2007-05-01), Kasai et al.

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