MEMS coupler and method to form the same

Details MEMS coupler and method to form the same MEMS coupler and method to form the same

2007-03-09

2010-12-28

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257S414000

Reexamination Certificate

active

07858422

ABSTRACT:
A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member is comprised of a first material and the coupler is comprised of a second material. In one embodiment, the first and second materials are substantially the same. In one embodiment, the second material is conductive and is different than the first material. In another embodiment, a method for fabricating a MEMS structure comprises first forming a member above a substrate. A coupler comprised of a conductive material is then formed to connect the member with the substrate.

REFERENCES:
patent: 4838088 (1989-06-01), Murakami
patent: 6846691 (2005-01-01), Hsu et al.
patent: 7023065 (2006-04-01), Ayazi et al.
patent: 7146016 (2006-12-01), Pedersen
patent: 7172917 (2007-02-01), Partridge et al.
patent: 2004/0209435 (2004-10-01), Partridge et al.
patent: 2005/0009233 (2005-01-01), Park et al.
patent: 2005/0019974 (2005-01-01), Lutz et al.
patent: 2005/0250236 (2005-11-01), Takeuchi et al.
patent: 2006/0108675 (2006-05-01), Colgan et al.
patent: 2006/0273416 (2006-12-01), Ayazi et al.
patent: 2007/0108513 (2007-05-01), Rub et al.
patent: 2007/0111365 (2007-05-01), Tateishi et al.
patent: 2008/0054759 (2008-03-01), Ayazi et al.
patent: 2008/0150647 (2008-06-01), Yang et al.
Lund, Jennifer L. et al., “A Low Temperature Bi-CMOS Compatible Process for MEMS RF Resonators and Filters,” Solid-State Sensor, Actuator and Microsystems Workshop, Jun. 2-6, 2002, pp. 38-41.
Jahnes, C. V., et al., “Simultaneous Fabrication of RF MEMS Switches and Resonators Using Copper-Based CMOS Interconnect Manufacturing Methods,” IEEE, 2004, pp. 789-792.
Wang, Jing, et al., “1.156-GHZ Self-Aligned Vibrating Micromechanical Disk Resonator,” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Dec. 2004, pp. 1607-1628, vol. 51, No. 12.

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