MEMS capping method and apparatus

Etching a substrate: processes – Etching of semiconductor material to produce an article...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S113000

Reexamination Certificate

active

06893574

ABSTRACT:
A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

REFERENCES:
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 5323051 (1994-06-01), Adams et al.
patent: 5594979 (1997-01-01), Borchelt et al.
patent: 5604160 (1997-02-01), Warfield
patent: 5798557 (1998-08-01), Salatino et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5915168 (1999-06-01), Salatino et al.
patent: 6555417 (2003-04-01), Spooner et al.
patent: 20020088988 (2002-07-01), Silverbrook
patent: 20020090180 (2002-07-01), Silverbrook
patent: 20030092229 (2003-05-01), Silverbrook
patent: 2001144117 (2001-05-01), None
patent: 2001269900 (2001-10-01), None
Yoshio Awatani et al., “Damage Free Dicing Method for MEMS Devices” International Conference on Opical MEMs; Conferen Digest pp. 137-138, Aug. 20-23, 2002.*
Smith et al., Micromachined Packaging for Chemical Microsensors, IEEE Trans. Electron Devices, Jun. 1988, vol. 35, No. 6 (pp. 787-792, numbered 192-197).
Petersen et al., Silicon Fusion Bonding for Pressure Sensors, Rec. of the IEEE Solid-State Sensor and Actuator Workshop, 1988, pp. 144-147, numbered 209-212.
Rudolf et al., Silicon Microaccelerometer, Transducers'87, Rec. of the 4thInt. Conf. on Solid-State Sensors and Actuators, 1987, pp. 395-398, numbered 376-379.
Ko et al., Bonding Techniques for Microsensors, Micromachining and Micropackaging of Transducers, 1985, pp. 198-208.
Roylance et al., A Batch-Fabricated Silicon Accelerometer, IEEE Trans. Electron Devices, Dec. 1979, vol. ED-26, No. 12, pp. 1911-1917, numbered 352-358.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MEMS capping method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MEMS capping method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MEMS capping method and apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3405111

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.