Memory module with different types of multi chip packages

Details Memory module with different types of multi chip packages Memory module with different types of multi chip packages

2008-05-13

2008-05-13

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S723000, C257S777000, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

11302052

ABSTRACT:
In an embodiment, a memory module includes a first group of multi chip packages, including one or more non-volatile memories, and a second group of multi chip packages, including one or more volatile memories, wherein the first and second groups of multi chip packages are electrically connected to a substrate. Various types of memory packages can be integrated into a single module that is mounted to the substrate, such as a printed circuit board, for improved size efficiency.

REFERENCES:
patent: 6545868 (2003-04-01), Kledzik et al.
patent: 6856009 (2005-02-01), Bolken et al.
patent: 05-299616 (1993-11-01), None
patent: 2001-007278 (2001-01-01), None
patent: 2000-0008962 (2000-05-01), None
patent: 2004-0023486 (2004-03-01), None
English language abstract of Korean Publication No. 2000-0008962.
English language abstract of Korean Publication No. 2004-0023486.
English language abstract of Japanese Publication No. 05-299616.

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