Memory module packaging test system

Error detection/correction and fault detection/recovery – Pulse or data error handling – Memory testing

Reexamination Certificate

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Details

C324S754090

Reexamination Certificate

active

07814379

ABSTRACT:
A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual in-line memory module (RDIMM) or a fully buffered dual in-line memory module (FBDIMM) so that the system may test an unbuffered dual in-line memory module (UDIMM).

REFERENCES:
patent: 6357022 (2002-03-01), Nguyen et al.
patent: 10-2001-0096954 (2001-11-01), None
patent: 10-2003-0017053 (2003-03-01), None
patent: 100459867 (2004-12-01), None
patent: 100549425 (2006-01-01), None
Korean Office Action dated Oct. 12, 2007.

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