Memory device having cross-shaped semiconductor fin structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S324000, C257SE29300, C257SE29309

Reexamination Certificate

active

07851844

ABSTRACT:
In an embodiment, a memory device, including: a semiconductor fin structure, each end portion of the fin structure including a source/drain region; a charge storage layer covering at least a portion of the fin structure; and a gate layer covering at least a portion of the charge storage layer.

REFERENCES:
patent: 6657252 (2003-12-01), Fried et al.
patent: 7091551 (2006-08-01), Anderson et al.
patent: 7629640 (2009-12-01), She et al.
patent: 2005/0199912 (2005-09-01), Hofmann et al.
patent: 2005/0242391 (2005-11-01), She et al.
patent: 2006/0001058 (2006-01-01), Dreeskornfeld et al.
patent: 2006/0170031 (2006-08-01), Kang et al.
patent: 2006/0292781 (2006-12-01), Lee
patent: 2008/0001176 (2008-01-01), Gopalakrishnan et al.
Eitan, B., et al., “NROM: A Novel Localized Trapping, 2-Bit Nonvolatile Memory Cell,” IEEE Electron Device Letters, vol. 21, No. 11, Nov. 2000, pp. 543-545.

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