Memory device forming methods

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S270000, C438S589000, C438S931000, C257SE21066, C257SE21646, C257SE21661, C257SE21680

Reexamination Certificate

active

07598134

ABSTRACT:
A memory device includes an array of memory cells and peripheral devices. At least some of the individual memory cells include carbonated portions that contain SiC. At least some of the peripheral devices do not include any carbonated portions. A transistor includes a first source/drain, a second source/drain, a channel including a carbonated portion of a semiconductive substrate that contains SiC between the first and second sources/drains and a gate operationally associated with opposing sides of the channel.

REFERENCES:
patent: 5510630 (1996-04-01), Agarwal
patent: 5734181 (1998-03-01), Ohba et al.
patent: 5742076 (1998-04-01), Sridevan et al.
patent: 5831337 (1998-11-01), Sato
patent: 6011278 (2000-01-01), Alok et al.
patent: 6150671 (2000-11-01), Harris et al.
patent: 6222217 (2001-04-01), Kunikiyo
patent: 6246091 (2001-06-01), Rodder
patent: 6278133 (2001-08-01), Harris et al.
patent: 6323506 (2001-11-01), Alok
patent: 6355944 (2002-03-01), Alok
patent: 6372618 (2002-04-01), Forbes et al.
patent: 6552363 (2003-04-01), Sridevan
patent: 6600192 (2003-07-01), Sugawara et al.
patent: 6627924 (2003-09-01), Hsu et al.
patent: 7078723 (2006-07-01), Lin et al.
patent: 7109548 (2006-09-01), Forbes et al.
patent: 2001/0055838 (2001-12-01), Walker et al.
patent: 2003/0022471 (2003-01-01), Taketomi et al.
patent: 2005/0230763 (2005-10-01), Huang et al.
patent: 63 204766 (1988-08-01), None
patent: 10 284724 (1998-10-01), None
patent: 495810 (2002-07-01), None
patent: PCT/US2005-026365 (2006-04-01), None
patent: PCT/US2005/026365 (2006-04-01), None
Kubo et al,Growth of SiC Films Using Tetraethylsilane, International Conference on Silicon Carbide and Related Materials (ICSCRM), Oct. 5-10, 2003, Lyon, France.
Abdou et al,Comparison of Different Metal Additive to Si for the Homoepitaxial Growth of 4H-SiC Layers by Vapour-Liquid-Solid Mechanism, International Conference on Silicon Carbide and Related Materials (ICSCRM), Oct. 5-10, 2003, Lyon, France.
Hernandez et al,Low Temperature ECR-PECVD Microcrystalline SiC Growth by Pulsed Gas Flows, International Conference on Silicon Carbide and Related Materials (ICSCRM), Oct. 5-10, 2003, Lyon, France.
Chassagne, et al,Investigation of 2 inch 3C-SiC Layers Grown in a Resistively-Heated LP-CVD Reactor with Horizontal “Hot-Walls,” International Conference on Silicon Carbide and Related Materials (ICSCRM), Oct. 5-10, 2003, Lyon, France.
Ernst et al,A New Si:C Epitaxial Channel nMOSFET Architecture with Improved Drivability and Short-Channel Characteristics, Jun. 10-12, 2003 Symposium on VLSI Technology Digest of Technical Papers.
Ernst et al,Fabrication of a Novel Strained SiGe:C-Channel Planar 55nm nMOSFET for High-Performance CMOS, Jun. 11-13, 2002 Symposium on VLSI Technology Digest of Technical Papers, p. 92-93.
Kim et al,The Breakthrough in Data Retention Time of DRAM Using Recess-Channel-Array Transistor(RCAT)for 88nm Feature Size and Beyond, Jun. 10-11, 2003 Symposium on VLSI Technology Digest of Technical Papers.
Eickhoff et al,Selective Growth of High-Quality 3C-SiC Using a SiO2Sacrificial-Layer Technique, Thin Solid Films, 345 (1999) p. 197-199.
D. Planson et al., “Design of a 600 V silicon carbide vertical power MOSFET” Materials Science and Engineering B61-62, Elsevier, Jul. 30, 1999, pp. 497-501.
W. Xie et al., “Development of nonvolatile random access memories in 6H-SiC”, Silicon Carbide and Related Materials 1995 Conference, Kyoto, Japan. IOP Publishing (1996), pp. 785-788.
W. Xie et al., “Cell Design and Peripheral Logic for Nonvolatile Random Access Memories in 6H-SiC”, Proceedings of the International Symposium on Compound Semiconductors, San Diego, Sep. 18-22, 1994. IOP Publishing (1995), pp. 395-398.
Kubo, Naoki, et al. “Growth of SiC films using tetraethylsilane” International Conference on Silicon Carbide and Related Materials (ICSCRM); Oct. 5-10, 2003; Lyon, France 2 pages.

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