Memory device and method of manufacturing the same

Details Memory device and method of manufacturing the same Memory device and method of manufacturing the same

2011-03-08

2011-03-08

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S314000, C438S257000

Reexamination Certificate

active

07902593

ABSTRACT:
In a memory device and a method of manufacturing the memory device, a source contact connected to a common source line may be formed on a drain region instead of a source region. A transistor having a negative threshold voltage may be formed between the source region and the drain region. A channel of the transistor may be formed. Because the source contact is formed on the drain region, the size of the source region may be reduced. An integration degree of the memory device may be improved. A control gate may linearly extend in a second direction because the source contact is not formed on the source region.

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