Memory card structure and manufacturing method thereof

Details Memory card structure and manufacturing method thereof Memory card structure and manufacturing method thereof

2007-04-17

2007-04-17

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S777000, C257S787000, C257S789000, C257SE25006, C257SE25013, C257SE25018, C438S106000, C438S112000, C438S124000, C438S126000, C438S127000, C438S508000

Reexamination Certificate

active

10904975

ABSTRACT:
A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

REFERENCES:
patent: 5811877 (1998-09-01), Miyano et al.
patent: 6777797 (2004-08-01), Egawa

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