Measuring the profile of a polishing pad in a chemical mechanica

Details Measuring the profile of a polishing pad in a chemical mechanica Measuring the profile of a polishing pad in a chemical mechanica

1999-03-01

1999-11-02

Fulton, Christopher W.

Geometrical instruments

Gauge

With support for gauged article

33554, 451443, G01B 520, G01B 728, B24B 5300

Patent

active

059746793

ABSTRACT:
A pad profiler has a three-point mount support the profiler above a polishing pad. A slider assembly is supported on a guide, and a sensor is connected to the slider assembly and positioned over a diametric segment of the polishing pad. The profiler uses a lead screw to drive the slider assembly across the polishing pad. The advantages of the invention include the measurement of the thickness of polishing pad to optimize polishing process parameters or to select a conditioning process. Additional advantages include stable support of the profiler over the pad, and smooth motion of the sensor along a radius of the pad.

REFERENCES:
patent: 4265022 (1981-05-01), Noguchi et al.
patent: 5068972 (1991-12-01), Herzog et al.
patent: 5189806 (1993-03-01), McMurtry et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5617645 (1997-04-01), Wick et al.
patent: 5851138 (1998-12-01), Hempel, Jr.
patent: 5868605 (1999-02-01), Cesna

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