Measuring slurry particle size during substrate polishing

Details Measuring slurry particle size during substrate polishing Measuring slurry particle size during substrate polishing

1996-08-26

1998-01-20

Breneman, R. Bruce

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

438 8, 438 16, 438747, 216 85, 451 6, 156345LC, G01N 1514

Patent

active

057100691

ABSTRACT:
A method of sensing a particle in a mixture includes providing (52) the mixture (36) having a particle (29, 30), moving (54) the mixture (36) in a direction, shining (56) a light into a portion of the moving mixture (36), reflecting a portion of the light off of the particle (29, 30) in the moving mixture (36), detecting and measuring (57) the reflected light, and using (58) the measured reflected light to determine a size of the particle (29, 30).

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