Measuring microscope arrangement for measuring thickness and lin

Details Measuring microscope arrangement for measuring thickness and lin Measuring microscope arrangement for measuring thickness and lin

1985-09-03

1987-06-23

LaRoche, Eugene R.

Optics: measuring and testing

By configuration comparison

With photosensitive film or plate

356384, G01C 308

Patent

active

046748830

ABSTRACT:
A measuring microscope arrangement is disclosed which includes a measuring microscope having a measuring head configured as a component which can be mounted on the microscope. The measuring head is suitable for the microdensitometric measurement of line widths as well as for the spectral interferometric measurement of thicknesses of objects such as semiconductor wafers, for example. In a first preferred embodiment of the arrangement of the invention, the object is scanned by displacing the object with the aid of a piezo table mounted on a scanning table utilized for obtaining a coarse position of the field of the object. The measuring microscope arrangement includes an objective for defining an intermediate image and the arrangement includes a measuring diaphragm mounted in the intermediate image. A diode-array spectrometer and an integral receiver are arranged behind the stationary diaphragm. A second preferred embodiment of the arrangement of the invention includes a further diode array in a second intermediate image plane in lieu of the integral measuring receiver. This further diode array is in addition to the diode-array spectrometer. In the second embodiment, a drive for the piezo table is unnecessary.

REFERENCES:
patent: 4087685 (1978-05-01), Froot
patent: 4201475 (1980-05-01), Bodlaj

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