Measurement of overlay offset in semiconductor processing

Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed

Reexamination Certificate

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C356S399000, C356S400000, C356S401000, C430S022000, C430S030000

Reexamination Certificate

active

07858404

ABSTRACT:
A method of semiconductor manufacturing including forming an overlay offset measurement target including a first feature on a first layer and a second feature on a second layer. The first feature and the second feature have a first predetermined overlay offset. The target is irradiated. The reflectivity of the irradiated target is determined. An overlay offset for the first layer and the second layer is calculated using the determined reflectivity.

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