Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Reexamination Certificate
2007-03-14
2010-12-28
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
C356S399000, C356S400000, C356S401000, C430S022000, C430S030000
Reexamination Certificate
active
07858404
ABSTRACT:
A method of semiconductor manufacturing including forming an overlay offset measurement target including a first feature on a first layer and a second feature on a second layer. The first feature and the second feature have a first predetermined overlay offset. The target is irradiated. The reflectivity of the irradiated target is determined. An overlay offset for the first layer and the second layer is calculated using the determined reflectivity.
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Gau Tsai-Sheng
Huang Te-Chih
Ke Chih-Ming
Garber Charles D
Haynes and Boone LLP
Sene Pape
Taiwan Semiconductor Manufacturing Company , Ltd.
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