Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1992-04-27
1994-05-31
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257666, 257698, 257 48, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
053171888
ABSTRACT:
A semiconductor device produced by a TAB method is provided which comprises a carrier tape section having a device hole, a first wiring layer formed on one surface of a tape section to be used for assembling the semiconductor device, a semiconductor chip retained in the device-hole electrically connected the first wiring layer, and a second wiring layer formed on the other surface of the tape section for electrically connecting the first wiring layer of the semiconductor device to the first wiring layer of a semiconductor device adjacently disposed thereto before being cut. By clamping the tape section on the widthwise sides with an electroconductive member pair electrically connected to each other, the first and second wiring layers are electrically connected. By disposing the electroconductive member pair in such a manner that is shown above to each of a plurality of semiconductor devices formed on the tape, these semiconductor devices can be electrically connected to the second wiring layer. By applying an electric signal for testing through the second wiring layer to the plurality of semiconductor devices, these devices can be test under such a state that is being formed on the carrier tape. It is preferable to electrically connect the first wiring layer to second wiring layer through through-holes formed in the tape.
REFERENCES:
patent: 5065227 (1991-11-01), Frankeny et al.
Clark Sheila V.
NEC Corporation
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