MCM package with bridge connection

Details MCM package with bridge connection MCM package with bridge connection

2005-03-08

2005-03-08

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S723000, C257S781000, C257S782000, C257S784000

Reexamination Certificate

active

06864588

ABSTRACT:
An MCM package with bridge connection mainly comprises a carrier, a first chip, a second chip and at least one conductive body. The carrier has an upper surface and an opposite lower surface, and a plurality of contacts formed on the upper surface of the carrier. The first chip has a first active surface, a first side surface and a first boding pad formed on the first active surface. Similarly, the second chip has a second active surface, a second side surface, and a second boding pad formed on the second active surface. Therein, the first side surface of the first chip is proximate to the second side surface of the second chip, and the first active surface is coplanar to the second active chip. Accordingly, one of the conductive body can be disposed continuously on the active surface and the second surface to electrically connect the first chip and the second chip.

REFERENCES:
patent: 4972250 (1990-11-01), Omori et al.
patent: 5198385 (1993-03-01), Devitt et al.
patent: 6410983 (2002-06-01), Moriizumi et al.
patent: 6521994 (2003-02-01), Huse et al.

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