Mask and simplified method of forming a mask integrating attenua

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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G03F 900

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active

058886788

ABSTRACT:
A mask and a method of forming a mask having a binary mask pattern in a first region of a transparent mask substrate and a rim type attenuating phase shifting mask pattern in a second region of the same transparent mask substrate. The rim type attenuating phase shifting mask pattern is used to form small contact holes and the binary mask pattern is used to form larger contact holes in an integrated circuit wafer. The use of the rim type attenuating phase shifting mask pattern and the binary mask pattern avoids the problems due to side lobe effect for cases where different size contact holes are required on the same layer in an integrated circuit wafer. The formation of the rim type attenuating phase shifting mask pattern and the binary mask pattern on the same transparent mask substrate increases throughput and decreases cost in the fabrication of integrated circuit wafers.

REFERENCES:
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patent: 5429897 (1995-07-01), Yoshioka et al.
patent: 5468578 (1995-11-01), Rolfson
patent: 5474865 (1995-12-01), Vasuder
patent: 5527645 (1996-06-01), Pati et al.
patent: 5792578 (1997-01-01), Tzu et al.

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