Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-07-10
2007-07-10
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S841000, C029S846000
Reexamination Certificate
active
11029969
ABSTRACT:
A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps, etching the metal layer exposed by said development to form said plurality of conductive bumps, removing said first photoresist, applying a second photoresist onto the metal layer, exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.
REFERENCES:
patent: 3767398 (1973-10-01), Morgan
patent: 3960561 (1976-06-01), Haining et al.
patent: 4209355 (1980-06-01), Burns
patent: 4372804 (1983-02-01), Hanabusa et al.
patent: 4983252 (1991-01-01), Masui et al.
patent: 5092032 (1992-03-01), Murakami
patent: 5200026 (1993-04-01), Okabe
patent: 5377406 (1995-01-01), Matsumoto et al.
patent: 5492233 (1996-02-01), Kusagaya
patent: 6222136 (2001-04-01), Appelt et al.
patent: 6684497 (2004-02-01), Appelt et al.
patent: 6902869 (2005-06-01), Appelt et al.
patent: 2001/0032828 (2001-10-01), Appelt et al.
patent: 2004/0091821 (2004-05-01), Appelt et al.
patent: 2005/0124096 (2005-06-01), Appelt et al.
Appelt Bernd Karl-Heinz
Bupp James Russell
Farquhar Donald Seton
Keesler Ross William
Klodowski Michael Joseph
Arbes Carl J.
Hogg William N.
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