4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

James Russell Bupp

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active

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Manufacturing methods for printed circuit boards

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate

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Manufacturing methods for printed circuit boards

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Manufacturing methods for printed circuit boards

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Printed circuit board with continuous connective bumps

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1715946

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