Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-06-07
2005-06-07
McPherson, John A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S313000, C430S316000, C430S318000, C430S319000, C029S592100, C029S825000, C029S846000, C029S847000, C216S018000, C216S048000, C216S095000
Reexamination Certificate
active
06902869
ABSTRACT:
A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.
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Appelt Bernd Karl-Heinz
Bupp James Russell
Farquhar Donald Seton
Keesler Ross William
Klodowski Michael Joseph
Chacko-Davis Daborah
Daugherty Patrick J.
Driggs Lucas Brubaker & Hogg Co. LPA
International Business Machines - Corporation
McPherson John A.
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