Manufacturing methods for printed circuit boards

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S313000, C430S316000, C430S318000, C430S319000, C029S592100, C029S825000, C029S846000, C029S847000, C216S018000, C216S048000, C216S095000

Reexamination Certificate

active

06902869

ABSTRACT:
A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps; etching the metal layer exposed by said development to form said plurality of conductive bumps; removing said first photoresist; applying a second photoresist onto the metal layer; exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.

REFERENCES:
patent: 3767398 (1973-10-01), Morgan
patent: 3960561 (1976-06-01), Haining et al.
patent: 4209355 (1980-06-01), Burns
patent: 4372804 (1983-02-01), Hanabusa et al.
patent: 4983252 (1991-01-01), Masui et al.
patent: 5092032 (1992-03-01), Murakami
patent: 5200026 (1993-04-01), Okabe
patent: 5377406 (1995-01-01), Matsumoto et al.
patent: 5492233 (1996-02-01), Kusagaya

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Manufacturing methods for printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing methods for printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing methods for printed circuit boards will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3469394

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.