Manufacturing method of semiconductor device and substrate...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S287000, C438S591000, C257SE21179

Reexamination Certificate

active

08071446

ABSTRACT:
A manufacturing method of a semiconductor device, including the steps of: loading into a processing chamber a substrate having a high dielectric gate insulating film and a metal electrode, with a side wall exposed by etching; applying oxidation processing to the substrate by supplying thereto hydrogen-containing gas and oxygen-containing gas excited by plasma, with the substrate heated to a temperature not allowing the high dielectric gate insulating film to be crystallized, in the processing chamber; and unloading the substrate after processing from the processing chamber.

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patent: 7772637 (2010-08-01), Sohn et al.
patent: 2005/0282338 (2005-12-01), Yoo et al.
patent: 2008/0135951 (2008-06-01), Kaushik
patent: 2009/0239368 (2009-09-01), Park et al.

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