Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-06-09
2009-02-10
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S275000, C438S510000, C438S770000, C257SE21285, C257SE21335
Reexamination Certificate
active
07488652
ABSTRACT:
After forming a field insulating film12on a substrate, sacrificing or gate oxidation films are formed as oxidation films14aand14b. An ion implantation layer18is formed by one or plurality of implantation process of argon (or fluoride) ion in an element hole12ausing a resist layer16as a mask via the oxidation film14a. When the oxidation films14aand14bare used as sacrificing oxidation films, gate oxidation films are formed in the element holes12aand12bafter removing the resist film16and the oxidation films14aand14b. When the oxidation films14aand14bare used as gate oxidation films, the oxidation films are once thinned by etching and then thickened after removing the resist layer16. The gate oxidation film14ais thicker than the gate oxidation film14bby forming the ion implantation layer18.
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Dickstein & Shapiro LLP
Ghyka Alexander G
Yamaha Corporation
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