Manufacturing method of a microelectromechanical switch

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S050000, C438S048000

Reexamination Certificate

active

07022542

ABSTRACT:
The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.

REFERENCES:
patent: 5638946 (1997-06-01), Zavracky
patent: 6872902 (2005-03-01), Cohn et al.
patent: 6903637 (2005-06-01), Miyazaki et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Manufacturing method of a microelectromechanical switch does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of a microelectromechanical switch, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of a microelectromechanical switch will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3570232

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.