Manufacturing apparatus for buried insulating layer-type...

Coating apparatus – Gas or vapor deposition

Reexamination Certificate

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C438S479000

Reexamination Certificate

active

07128788

ABSTRACT:
A manufacturing method for a buried insulating layer-type semiconductor silicon carbide substrate comprises the step of placing an SOI substrate100,which has a surface silicon layer130of a predetermined thickness and a buried insulator120,in a heating furnace200and of increasing the temperature of the atmosphere within heating furnace200while supplying a mixed gas (G1+G2) of a hydrogen gas G1and of a hydrocarbon gas G2into heating furnace200,thereby, of metamorphosing surface silicon layer130of SOI substrate100into a single crystal silicon carbide thin film140.

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patent: 5759908 (1998-06-01), Steckl et al.
patent: 5880491 (1999-03-01), Soref et al.
patent: 0454456 (1991-10-01), None
patent: 1265274 (2002-12-01), None
patent: 06191997 (1994-07-01), None
Andrew J. Steckl and J.P. Li, “Epitaxial Growth of beta-SiC on Si by RTCVD with C3H8 and SiH4”, IEEE Transactions on Electron Devices, vol. 39, No. 1, Jan. 1992, pp. 64-74.
European Search Report dated Dec. 16, 2005.

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