Manufacture of planarized insulating layer

Details Manufacture of planarized insulating layer Manufacture of planarized insulating layer

1995-07-31

1997-09-09

Niebling, John

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Multiple layers

438780, 438624, H01L 2144

Patent

active

056656432

ABSTRACT:
A method of manufacturing a semiconductor device having an insulating film includes the steps of: preparing a substrate having a step on a surface thereof; coating polysilazane on the surface of the substrate; and curing the polysilazane in a non-oxidizing atmosphere. Polysilazane coated on a substrate can be cured without corrosion and destruction of underlie wiring patterns.

REFERENCES:
patent: 4103045 (1978-07-01), Lesaicherre et al.
patent: 4826733 (1989-05-01), Haluska et al.
patent: 5310720 (1994-05-01), Shin et al.
patent: 5436083 (1995-07-01), Haluska et al.
Stanley Wolf, "Silicon Processing for the VLSI Era vol. 2" Lattice Press (Calif.) (1990) pp. 194-195 and 430-431.

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