Manufacture method of semiconductor device with gate...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S981000

Reexamination Certificate

active

06953727

ABSTRACT:
A method of manufacturing a semiconductor device, having the steps of: (a) forming a first gate insulating film having a first thickness in a plurality of regions on a surface of a semiconductor substrate; (b) removing the first gate insulating film in a first region among the plurality of regions and allowing a native oxide film to be formed; (c) heating the semiconductor substrate in a reducing atmosphere and selectively reducing and removing the native oxide film formed in the step (b); and (d) after the step (c), forming a second gate insulating film having a second thickness thinner than the first thickness on the surface of the semiconductor substrate in the first region.

REFERENCES:
patent: 5989948 (1999-11-01), Vines et al.
patent: 6171911 (2001-01-01), Yu
patent: 6258673 (2001-07-01), Houlihan et al.
patent: 6551884 (2003-04-01), Masuoka
patent: 6759302 (2004-07-01), Chen et al.
patent: 07-335661 (1995-12-01), None
patent: 08-321443 (1996-12-01), None
patent: 09-232325 (1997-09-01), None
patent: 2000-182574 (2000-06-01), None
Notification of the First Office Action dated Jun. 10, 2005.

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