Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-10-11
2005-10-11
Chaudhari, Chandra (Department: 2891)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S981000
Reexamination Certificate
active
06953727
ABSTRACT:
A method of manufacturing a semiconductor device, having the steps of: (a) forming a first gate insulating film having a first thickness in a plurality of regions on a surface of a semiconductor substrate; (b) removing the first gate insulating film in a first region among the plurality of regions and allowing a native oxide film to be formed; (c) heating the semiconductor substrate in a reducing atmosphere and selectively reducing and removing the native oxide film formed in the step (b); and (d) after the step (c), forming a second gate insulating film having a second thickness thinner than the first thickness on the surface of the semiconductor substrate in the first region.
REFERENCES:
patent: 5989948 (1999-11-01), Vines et al.
patent: 6171911 (2001-01-01), Yu
patent: 6258673 (2001-07-01), Houlihan et al.
patent: 6551884 (2003-04-01), Masuoka
patent: 6759302 (2004-07-01), Chen et al.
patent: 07-335661 (1995-12-01), None
patent: 08-321443 (1996-12-01), None
patent: 09-232325 (1997-09-01), None
patent: 2000-182574 (2000-06-01), None
Notification of the First Office Action dated Jun. 10, 2005.
Chaudhari Chandra
Fujitsu Limited
Westerman, Hattori, Daniels and Adrian LLP
LandOfFree
Manufacture method of semiconductor device with gate... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacture method of semiconductor device with gate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacture method of semiconductor device with gate... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3476850