Magnetron sputtering apparatus and method

Details Magnetron sputtering apparatus and method Magnetron sputtering apparatus and method

1995-12-26

1999-02-02

Nuzzolillo, M.

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429816, 20429817, 20429819, 2042982, 20429812, C23C 1435

Patent

active

058659617

ABSTRACT:
A magnetron sputtering apparatus has a plurality of ring-shaped flat targets with different diameters disposed about one center axis. The apparatus includes magnets having the same polarity as each other and placed on both front surface side and rear surface side of each of the targets along an inner circumferential edge thereof, and magnets having the same polarity as each other and placed on both front surface side and rear surface side of each of the targets along an outer circumferential edge thereof. The magnets placed along the inner and outer circumferential edges are placed in such a way that the magnets along the inner circumferential edge and the magnets along the outer circumferential edge become opposite in polarity to each other.

REFERENCES:
patent: 4515675 (1985-05-01), Kieser et al.
patent: 4761218 (1988-08-01), Boys
patent: 4865712 (1989-09-01), Mintz
patent: 5106470 (1992-04-01), Takei et al.

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