Magnetron for low pressure full face erosion

Details Magnetron for low pressure full face erosion Magnetron for low pressure full face erosion

1996-03-13

1999-05-25

Wong, Don

Electric lamp and discharge devices: systems

Discharge device load with fluent material supply to the...

Plasma generating

20429807, 20429808, 2042982, C23C 1434

Patent

active

059072202

ABSTRACT:
A method for controlling the operation of a magnetron source for sputtering a surface of a target in a vacuum chamber, the method including the steps of: during a low pressure phase of sputtering, causing a magnetic field generated by a the magnetron source to be confined primarily to an inner region of the surface of the target so as to reduce leakage of electrons away from the target during sputtering; and during a subseguent high pressure phase of sputtering, causing the magnetic field generated by the magnet assembly to extend into the outer region of the surface of the target so as to sputter material from the outer region of the surface of the target. The pressure of the high pressure phase of sputtering is higher than the pressure of the low pressure phase of sputtering.

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Rossnagel, "Deposition and redeposition in magnetrons," J. Vac.Sci.Technol. A 6(6) Nov./Dec. 1988 pp. 3049-3054.
Copy of Partial European Search Report dated Jun. 24, 1997.

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