Magnetron cathode and magnetron sputtering apparatus...

Details Magnetron cathode and magnetron sputtering apparatus... Magnetron cathode and magnetron sputtering apparatus...

2006-05-30

2006-05-30

Philogene, Haissa (Department: 2828)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298210, C204S298160, C204S298370

Reexamination Certificate

active

07052583

ABSTRACT:
A magnetron cathode and a sputtering apparatus including the same are provided. The magnetron cathode includes three or more magnet units, each of which comprises a single magnet or a plurality of magnets having the same poles facing toward the same direction, wherein one magnet unit is disposed around the outer circumference of another magnet unit and adjacent magnet units have opposite poles facing toward the same direction. Uniform magnetic field distribution is obtained. Therefore, the erosion profile of a target is wide and uniform.

REFERENCES:
patent: 4407713 (1983-10-01), Zega
patent: 4904362 (1990-02-01), Gaertner et al.
patent: 5171411 (1992-12-01), Hillendahl et al.
patent: 5382344 (1995-01-01), Hosokawa et al.
patent: 5656138 (1997-08-01), Scobey et al.
patent: 2003/0019739 (2003-01-01), Shibamoto et al.
patent: 2003/0178299 (2003-09-01), Shin et al.
patent: 2003/0209431 (2003-11-01), Brown

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