Magazine for holding disk-type workpieces in particular semicond

Details Magazine for holding disk-type workpieces in particular semicond Magazine for holding disk-type workpieces in particular semicond

1992-01-21

1993-08-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156654, 156657, 156662, 156345, 134 33, H01L 21306, B44C 122, C03C 1500

Patent

active

052365484

ABSTRACT:
A magazine is provided for holding disk-type workpieces, in particular seonductor wafers, in the wet-chemical surface treatment in liquid baths. The magazine is particularly useful for etching semiconductor wafers in a liquid bath, which contains an insert (5) which has a diameter of 1.1-1.9 times the diameter of the wafer (6) and which has arrangements of guide strut assemblies (12) held parallel at a spacing of at least twice the wafer thickness by spacing struts (8). The guide strut assemblies (12) comprise main guide struts (9) and subsidiary guide struts (10) which diverge at the linking points (13), which do not lie on the housing axis, in not more than three directions. This etching magazine makes possible a marked reduction in the deterioration in the wafer geometry normally observed in etching treatments.

REFERENCES:
patent: 3679517 (1972-07-01), Schulten et al.
patent: 3727620 (1973-04-01), Orr
patent: 3808065 (1974-04-01), Harvey et al.
patent: 3977926 (1976-08-01), Johnson et al.

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