Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2011-08-02
2011-08-02
Zervigon, Rudy (Department: 1716)
Coating apparatus
Gas or vapor deposition
With treating means
C156S345100
Reexamination Certificate
active
07987814
ABSTRACT:
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is configured to equalize the flow of the processing gases evacuated from the chamber via the lower liner.
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PCT International Search Report and Written Opinion for Application No. PCT/US2009/039662 dated Nov. 24, 2009.
Balakrishna Ajit
Carducci James D.
Kutney Michael C.
Nguyen Andrew
Applied Materials Inc.
Patterson & Sheridan L.L.P.
Zervigon Rudy
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