Low thermal impedance integrated circuit

Details Low thermal impedance integrated circuit Low thermal impedance integrated circuit

1993-11-30

2000-02-22

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257247, 257664, 257690, 257712, 257717, 257728, 257743, 257774, H01L 27148, H01L 29768, H01L 23495

Patent

active

060283483

ABSTRACT:
A frontside ground plane (306) integrated circuit with backside contacts (312) plus optional passive components such as microstrip (308) and capacitors. The frontside ground plane provides direct heat dissipation from active junctions such as heterojunction and field effect transistors.

REFERENCES:
patent: 4794093 (1988-12-01), Tong et al.
patent: 4992764 (1991-02-01), Ayasli
patent: 5084750 (1992-01-01), Adlerstein
patent: 5202752 (1993-04-01), Honjo

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