Low temperature packaging apparatus and method

Details Low temperature packaging apparatus and method Low temperature packaging apparatus and method

2006-04-04

2006-04-04

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S705000, C257S706000, C257S750000, C438S627000, C438S628000, C361S701000, C361S702000, C361S709000

Reexamination Certificate

active

07023089

ABSTRACT:
Some embodiments disclose a low temperature semiconductor packaging apparatus and method. An apparatus generally comprises a heat spreader, a silicon die, and a thermal interface material disposed between the heat spreader and the silicon die comprising a plurality of metals capable of forming a transient liquid phase bond. A method generally comprises attaching a silicon die to a substrate, depositing a thermal interface material on at least one of the silicon die and a heat spreader, and attaching the heat spreader to the silicon die, wherein the thermal interface material comprises a plurality of metals capable of forming a transient liquid phase bond. Other embodiments are also described and claimed.

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Kulojarvi, Kari and Kivilahti, Jorma K., IEEE Transactions On Components, Packaging, And Manufacturing Technology—Part A, “A Low Temperature Interconnection Method for Electronics Assembly”, vol. 21, No. 2, Jun. 1998, pp. 288-291.
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Roman, John W. and Eagar, Thomas W., The International Society for Hybrid Microelectronics (ISHM) Symposium Proceedings, Oct. 1992, Low Stress Die Attach by Low Temperatur Transient Liquid Phase Bonding, Methods in Cell Biology, ISHM, pp. 1-6.

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