Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1996-10-30
1999-07-20
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438631, 438636, 438646, 438672, H01L 21283, H01L 21324, H01L 21477
Patent
active
059267364
ABSTRACT:
The present invention provides a method for minimizing voids in a plug. The process begins by forming a conformal barrier layer within the hole and then forming a metal plug within the hole. Thereafter, a cap layer is formed over the metal plug in which the cap layer has a lower thermal expansion coefficient than the metal plug. The hole is heated such that the metal in the hole flows to eliminate the void as a result of the compressive stress generated by the cap layer on the metal plug.
REFERENCES:
patent: 4997518 (1991-03-01), Madokoro
patent: 5066611 (1991-11-01), Yu
patent: 5124780 (1992-06-01), Sandhu et al.
patent: 5266521 (1993-11-01), Lee et al.
patent: 5418187 (1995-05-01), Miyanaga et al.
patent: 5427982 (1995-06-01), Jun
patent: 5523259 (1996-06-01), Merchant et al.
patent: 5534463 (1996-07-01), Lee et al.
patent: 5552341 (1996-09-01), Lee
patent: 5604155 (1997-02-01), Wang
patent: 5610105 (1997-03-01), Vines et al.
patent: 5665641 (1997-09-01), Shen et al.
patent: 5668055 (1997-09-01), Xu et al.
Z. Shterenfeld-Lavie et al, "A 3-Level, 0.35 .mu.m Interconnection Process Using an Innovative, High Pressure Aluminum Plug Technology," Proceedings of the VMIC Conf., pp. 31-37 (Jun. 27-29, 1995).
Galanthay Theodore E.
Hill Kenneth C.
Jorgenson Lisa K.
Nguyen Ha Tran
Niebling John F.
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