Low fabrication cost, fine pitch and high reliability solder...

Details Low fabrication cost, fine pitch and high reliability solder... Low fabrication cost, fine pitch and high reliability solder...

2007-10-31

2008-12-23

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S611000, C438S652000, C438S739000, C438S754000, C257SE23022, C257SE23021, C257SE23043

Reexamination Certificate

active

07468316

ABSTRACT:
A barrier layer is deposited over a layer of passivation including in an opening to a contact pad created in the layer of passivation. A column of three layers of metal is formed overlying the barrier layer and aligned with the contact pad and having a diameter that is about equal to the surface of the contact pad. The three metal layers of the column comprise, in succession when proceeding from the layer that is in contact with the barrier layer, a layer of pillar metal, a layer of under bump metal and a layer of solder metal. The layer of pillar metal is reduced in diameter, the barrier layer is selectively removed from the surface of the layer of passivation after which reflowing of the solder metal completes the solder bump of the invention.

REFERENCES:
patent: 3874072 (1975-04-01), Rose
patent: 5656858 (1997-08-01), Kondo et al.
patent: 5937320 (1999-08-01), Andricacos et al.

Affiliated with

Also associated with

Rating

Low fabrication cost, fine pitch and high reliability solder... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low fabrication cost, fine pitch and high reliability solder..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low fabrication cost, fine pitch and high reliability solder... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4024635