Low dielectric constant, low moisture uptake polyimides and copo

Details Low dielectric constant, low moisture uptake polyimides and copo Low dielectric constant, low moisture uptake polyimides and copo

1989-11-13

1993-04-27

Lesmes, George F.

Stock material or miscellaneous articles

Composite

Of silicon containing

4284735, 428458, 528353, B32B 904, B32B 2700, C08G 6926

Patent

active

052060918

ABSTRACT:
A group of polyimides and copolyimides made from 6FDA, IPAN, or their acid or ester forms, and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.

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