Low cost packaging for thin-film resonators and thin-film resona

Details Low cost packaging for thin-film resonators and thin-film resona Low cost packaging for thin-film resonators and thin-film resona

1998-02-12

2000-07-11

Chaudhari, Chandra

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438118, H01L 2100

Patent

active

060871989

ABSTRACT:
An acoustic reflector (48) is applied over a thin-film piezoelectric resonator (41, 61) which is supported on a semiconductor or semiconductor-compatible substrate (42, 62) of a microelectronic device (40, 60), enabling an encapsulant (49) to be applied over the reflector-covered resonator without acoustically damping the resonator. In one embodiment, alternating high and low acoustic impedance layers (51, 53 . . . 55) of one-quarter wavelength thicknesses constructively reflect the resonating wavelength to make an encapsulant in the form of an inexpensive plastic molding compound appear as a "clamping" surface to a resonator (41) peripherally supported over an opening (43) on a silicon substrate (42). In another embodiment, an encapsulant- and reflector-covered resonator (61) is mechanically supported above a second reflector (68) which eliminates the need for peripheral support, making substrate (68) also appear as a clamping surface. The invention enables low cost plastic packaging of resonators and associated circuitry on a single monolithic structure. A radio frequency transceiver front-end application is given as an exemplary implementation.

REFERENCES:
patent: 5212115 (1993-05-01), Cho et al.
patent: 5348617 (1994-09-01), Braymen
patent: 5373268 (1994-12-01), Dworsky et al.
patent: 5461001 (1995-10-01), Kurtz et al.
patent: 5801069 (1998-09-01), Harada et al.

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