Low cost hermetic sealed microwave module packaging

Details Low cost hermetic sealed microwave module packaging Low cost hermetic sealed microwave module packaging

1999-03-23

2000-02-22

Kunemund, Robert

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

438695, 438696, H01L 21311

Patent

active

060280077

ABSTRACT:
The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.

REFERENCES:
patent: 4650108 (1987-03-01), Gallagher
patent: 4676817 (1987-06-01), Tailor et al.
patent: 4922323 (1990-05-01), Potter
patent: 4953001 (1990-08-01), Kaiser, Jr. et al.
patent: 5041943 (1991-08-01), Ilardi et al.
patent: 5433260 (1995-07-01), Taylor

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