4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with coating step

John E. Dowsing, III

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High frequency microelectronic circuit enclosure

Wave transmission lines and networks – Coupling networks – With impedance matching
Patent

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Low cost hermetic sealed microwave module packaging

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Low cost hermetic sealed microwave module packaging

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent

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Low dielectric constant interconnect for multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Profile ID: LFUS-PAI-P-750404

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