Low cost ball grid array device and method of manufacture thereo

Details Low cost ball grid array device and method of manufacture thereo Low cost ball grid array device and method of manufacture thereo

1996-05-17

1998-07-21

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257697, 257738, 257698, 438613, H01L 2348, H01L 2352, H01L 2940, H01L 2304

Patent

active

057838666

ABSTRACT:
A panel of, for example, bismaleimide triazine (BT) or ceramic (Al.sub.2 O.sub.3) is chosen in size to be substantially filled with and taken up by end-result ball grid array (BGA) devices. The end-result devices are positioned closely together and take up substantially the entire area of the initial panel. Structural weakening is provided at appropriate places in the panel to allow the devices to be readily singulated.

REFERENCES:
patent: 4082394 (1978-04-01), Gednoy et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 5569960 (1996-10-01), Kumazawa et al.

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