Low cost ball grid array device and method of manufacture thereo

Details Low cost ball grid array device and method of manufacture thereo Low cost ball grid array device and method of manufacture thereo

1998-02-20

2000-04-25

Booth, Richard

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438113, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

060543388

ABSTRACT:
A panel of, for example, bismaleimide triazine (BT) or ceramic (Al.sub.2 O.sub.3) is chosen in size to be substantially filled with and taken up by end-result ball grid array (BGA) devices. The end-result devices are positioned closely together and take up substantially the entire area of the initial panel. Structural weakening is provided at appropriate places in the panel to allow the devices to be readily singulated.

REFERENCES:
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5357672 (1994-10-01), Newman
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 5652185 (1997-07-01), Lee
patent: 5729437 (1998-03-01), Hashimoto

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