Low-adhesion material, resin molding die, and soil resistant...

Details Low-adhesion material, resin molding die, and soil resistant... Low-adhesion material, resin molding die, and soil resistant...

2011-03-08

2011-03-08

Blackwell, Gwendolyn (Department: 1784)

Stock material or miscellaneous articles

Composite

Of inorganic material

C428S689000, C428S699000, C428S701000, C428S702000

Reexamination Certificate

active

07901797

ABSTRACT:
An upper die has a cavity member constituting an inner bottom surface of a cavity, and a surrounding member. The cavity member is formed of a low adhesion material in accordance with the present invention, and includes a body portion and a surface layer formed on an undersurface of the body portion exposed to a fluid resin. The body portion is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer is formed of Y2O3having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.

REFERENCES:
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Srinivasan et al., “R curve effects in solid particle erosion of ceramics”. Wear, 142 (1991) pp. 115-133.

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