Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-03-28
2009-08-18
Toledo, Fernando L (Department: 2895)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S157000, C438S164000, C438S197000
Reexamination Certificate
active
07575976
ABSTRACT:
In one embodiment, the present invention includes a double gate transistor having a silicon fin formed on a buried oxide layer and first and second insulation layers formed on a portion of the silicon fin, where at least the second insulation layer has a pair of portions extending onto respective first and second portions of the silicon fin to each act as a self-aligned spacer structure. Other embodiments are described and claimed.
REFERENCES:
patent: 2003/0013243 (2003-01-01), Doumae
patent: 2007/0048958 (2007-03-01), Liao et al.
patent: 2007/0111454 (2007-05-01), Yeo et al.
patent: 2008/0149984 (2008-06-01), Chang et al.
patent: 2008/0186752 (2008-08-01), Kim
U.S. Appl. No. 11/395,860, filed Mar. 31, 2006, entitled “Stacked Multi-Gate Transistor Design And Method Of Fabrication,” by Brian S. Doyle, et al.
U.S. Appl. No. 11/499,127, filed Aug. 4, 2006, entitled “Double Gate Transistor, Method Of Manufacturing Same, And System Containing Same,” by Ibrahim Ban.
U.S. Appl. No. 11/474,153, filed Jun. 23, 2006, entitled “Double Gate Transistor, Method Of Manufacturing Same, And System Containing Same,” by Ibrahim Ban and Uday Shah.
Ban Ibrahim
Shah Uday
Intel Corporation
Lee Jae
Toledo Fernando L
Trop Pruner & Hu P.C.
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