Local plasma processing

Details Local plasma processing Local plasma processing

2008-05-20

2008-05-20

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C257SE21533

Reexamination Certificate

active

07375039

ABSTRACT:
A method and an apparatus for performing the method. The method includes: (a) providing an apparatus, wherein the apparatus comprises (i) a chamber, (ii) a plasma device being in and coupled to the chamber, (iii) a shower head being in and coupled to the chamber, and (iv) a chuck being in and coupled to the chamber; (b) placing the substrate on the chuck; (c) using the plasma device to receive a plasma device gas and generate a plasma; (d) directing the plasma at a pre-specified area on the substrate; and (e) using the shower head to receive and distribute a shower head gas in the chamber, wherein the plasma device gas and the shower head gas are selected such that the plasma and the shower head gas when mixed with each other result in a chemical reaction that forms a film at the pre-specified area on the substrate.

REFERENCES:
patent: 5804259 (1998-09-01), Robles
patent: 6042687 (2000-03-01), Singh et al.
patent: 6045877 (2000-04-01), Gleason et al.
patent: 6893907 (2005-05-01), Maydan et al.
patent: 2002/0030038 (2002-03-01), Bollinger et al.
patent: 2002/0094388 (2002-07-01), Fonash et al.
patent: 2002/0134403 (2002-09-01), Selwyn et al.
patent: 2003/0049390 (2003-03-01), Shanmugasundram et al.
patent: 2003/0116281 (2003-06-01), Herbert et al.
patent: 2003/0129107 (2003-07-01), Denes et al.
patent: 2003/0196680 (2003-10-01), Lee et al.
patent: 2003/0213561 (2003-11-01), Selwyn et al.
patent: 2004/0050685 (2004-03-01), Yara et al.
patent: 2004/0091642 (2004-05-01), Murakami et al.
patent: 2004/0187783 (2004-09-01), Maeda et al.
patent: 2006/0228897 (2006-10-01), Timans
patent: 2003268553 (2003-09-01), None
patent: 2004137571 (2004-05-01), None
patent: WO 2004012235 (2004-02-01), None

Affiliated with

Also associated with

Rating

Local plasma processing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Local plasma processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Local plasma processing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2769701