Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate
2011-06-14
2011-06-14
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Miscellaneous
C118S640000
Reexamination Certificate
active
07960297
ABSTRACT:
A semiconductor processing tool heats wafers using radiant heat and resistive heat in chamber or in a load lock where pressure changes. The wafers are heated in greater part with a resistive heat source until a transition temperature or pressure is reached, then they are heated in greater part with a radiant heat source. Throughput improves for the tool because of the wafers can reach a high temperature uniformly in seconds.
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Hamilton Shawn
Nordin Michael
Powell Ron
Rivkin Michael
Coleman W. David
Novellus Systems Inc.
Weaver Austin Villeneuve & Sampson LLP
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