Load lock chamber for large area substrate processing system

Material or article handling – Associated with semiconductor wafer handling – Including means for charging or discharging wafer cassette

Reexamination Certificate

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C414S939000, C414S641000, C414S774000, C414S754000, C414S777000, C901S047000

Reexamination Certificate

active

10832795

ABSTRACT:
A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.

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