Load cup for chemical mechanical polishing

Details Load cup for chemical mechanical polishing Load cup for chemical mechanical polishing

2006-05-16

2006-05-16

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S288000

Reexamination Certificate

active

07044832

ABSTRACT:
Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.

REFERENCES:
patent: 4466852 (1984-08-01), Beltz et al.
patent: 4519846 (1985-05-01), Aigo
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5762543 (1998-06-01), Kasprzyk et al.
patent: 5934984 (1999-08-01), Togawa et al.
patent: 5947802 (1999-09-01), Zhang et al.
patent: 6050884 (2000-04-01), Togawa et al.
patent: 6074275 (2000-06-01), Yashiki et al.
patent: 6102777 (2000-08-01), Duescher et al.
patent: 6131589 (2000-10-01), Vogtmann et al.
patent: 6196896 (2001-03-01), Sommer
patent: 6402598 (2002-06-01), Ahn et al.
patent: 6537143 (2003-03-01), Yang et al.
patent: 6629883 (2003-10-01), Katsuoka et al.
patent: 6716086 (2004-04-01), Tobin
patent: 2003/0003848 (2003-01-01), Tobin
patent: 2004/0127142 (2004-07-01), Olgado
patent: 0347718 (1989-12-01), None
patent: 1323350 (1987-07-01), None
patent: WO 99/41022 (1999-08-01), None

Affiliated with

Also associated with

Rating

Load cup for chemical mechanical polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Load cup for chemical mechanical polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Load cup for chemical mechanical polishing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3588870