Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-07-27
1993-08-10
Chaudhuri, Olik
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
437119, 437130, C30B 700, H01L 21208
Patent
active
052345343
ABSTRACT:
A liquid-phase growth process of a compound semiconductor which is capable of effectively controlling the generation of a surface defect and improve the product quality and production yield is disclosed in which before the start of liquid-phase growth, a substrate and a solution are held in a 100% hydrogen atmosphere or a mixed gas atmosphere consisting of more than 80% of hydrogen and the rest of an inert gas, and immediately before the start of the liquid-phase growth, the atmosphere is changed to a mixed gas atmosphere consisting of not more than 60% of hydrogen and the rest of the inert gas.
REFERENCES:
patent: 4110133 (1978-08-01), Garret et al.
patent: 4268327 (1981-05-01), Uragaki et al.
Pak et al, "Suppression of thermal damage of InP by adding Ar in H.sub.2 Atmosphere" Jap. J. Appl. Phys, vol. 18 (1979) pp. 1859-1860.
Higuchi Susumu
Nakamura Akio
Otaki Toshio
Yanagisawa Munehisa
Chaudhuri Olik
Paladugu Ramamohan Kao
Shin-Etsu Handotai & Co., Ltd.
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