Liquid-phase growth process of compound semiconductor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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437119, 437130, C30B 700, H01L 21208

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052345343

ABSTRACT:
A liquid-phase growth process of a compound semiconductor which is capable of effectively controlling the generation of a surface defect and improve the product quality and production yield is disclosed in which before the start of liquid-phase growth, a substrate and a solution are held in a 100% hydrogen atmosphere or a mixed gas atmosphere consisting of more than 80% of hydrogen and the rest of an inert gas, and immediately before the start of the liquid-phase growth, the atmosphere is changed to a mixed gas atmosphere consisting of not more than 60% of hydrogen and the rest of the inert gas.

REFERENCES:
patent: 4110133 (1978-08-01), Garret et al.
patent: 4268327 (1981-05-01), Uragaki et al.
Pak et al, "Suppression of thermal damage of InP by adding Ar in H.sub.2 Atmosphere" Jap. J. Appl. Phys, vol. 18 (1979) pp. 1859-1860.

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