Linear pattern detection method and apparatus

Details Linear pattern detection method and apparatus Linear pattern detection method and apparatus

2009-02-26

2011-12-20

Nguyen, Sang (Department: 2886)

Image analysis

Applications

Manufacturing or product inspection

C382S141000, C356S237400

Reexamination Certificate

active

08081814

ABSTRACT:
The present invention provides a linear pattern detection method which can extract and detect linear patterns distinguished by a microscopic defect distribution profile even if skipped measurements are taken. The linear pattern detection method acquires a defect map created based on results of defect inspection of a wafer; divides the defect map into a plurality of first segments; calculates a correlation coefficient of a point sequence in each of the first segments, the point sequence corresponding to a defect group contained in the first segments; calculates a total number of those first segments in which the correlation coefficient is equal to or larger than a first threshold; and determines that the wafer contains a linear pattern if the total number is equal to or larger than a second threshold.

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Notification of Reasons for Rejection issued by the Japanese Patent Office on Aug. 6, 2010, for Japanese Patent Application No. 2008-049901, and English-language translation.

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