Lid assembly for semiconductor processing chamber

Details Lid assembly for semiconductor processing chamber Lid assembly for semiconductor processing chamber

1996-04-16

1999-05-25

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118715, 20429809, 165168, 165169, C23C 1600, C23C 1400, F28F 312

Patent

active

059066830

ABSTRACT:
A method and apparatus for controlling the temperature, maintaining the vacuum integrity and facilitating maintenance of a lid assembly (2) in a wafer processing apparatus. The apparatus comprises a gas distribution plate (42) defining one or more gas distribution holes (50) formed therethrough for passage of process gas(es), and a base plate (10) thermally coupled to the gas distribution plate. The base plate (10) has a gas inlet in communication with the gas distribution holes, a fluid inlet (98) for receiving a coolant fluid and a fluid outlet (102) for discharging the coolant fluid. A fluid passage (94) is formed through portions of the base plate in communication with the fluid inlet and outlet to allow a coolant fluid to flow therethrough and to transfer heat from the gas injection and distribution plates. The base plate is an integral, single piece that minimizes the use of gas seals in the lid assembly and facilitates disassembly and assembly of the lid assembly for cleaning and other maintenance.

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