4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Soon-cheol Kweon

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Fluid jetting apparatus and a process for manufacturing the...

Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate

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Fluid jetting apparatus and a process for manufacturing the...

Fluid sprinkling – spraying – and diffusing – Processes
Reexamination Certificate

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Image bearing structure and method to detect a defect in the...

Incremental printing of symbolic information – Electric marking apparatus or processes – Electrostatic
Reexamination Certificate

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LED array module

Illumination – Light source and modifier – With ventilating – cooling or heat insulating means
Reexamination Certificate

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LED package and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2196460

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